Alexandrine GUEDON-GRACIA

Associate Professor

Research group : RELIABILITY

Team : REMI,RIAD

Tel : 0540003334

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Article (23)

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test Author(s): K.E. Akoda, A. Guédon-Gracia, J.-Y. Delétage, B. Plano, H. Frémont Year of publication: 2021 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114286 HAL link: https://hal.science/hal-03375855v1
From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue Author(s): E. Ben Romdhane, P. Roumanille, A. Guédon-Gracia, S. Pin, P. Nguyen, H. Frémont Year of publication: 2021 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114288 HAL link: https://hal.science/hal-03375843v1
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging Author(s): Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont Year of publication: 2021 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114201 HAL link: https://hal.science/hal-03375916v1
Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability Author(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Year of publication: 2020 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2020.113883 HAL link: https://hal.science/hal-03011606v1
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components Author(s): E. Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont Year of publication: 2020 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2020.113812 HAL link: https://hal.science/hal-03011618v1
Les cartes d’extension PCBmod : conception et applications pédagogiques VHDL et micro-assemblage Author(s): Alexandrine Gracia, Hélène Debéda, Jean Tomas Year of publication: 2019 Journal: Journal sur l'enseignement des sciences et technologies de l'information et des systèmes DOI: 10.1051/j3ea/20191011 HAL link: https://hal.science/hal-02442408v1
Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Author(s): S. Pin, A. Gracia, J.-Y. Delétage, H. Fremont Year of publication: 2019 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2019.113484 HAL link: https://hal.science/hal-02515004v1
Sequential combined thermal cycling and vibration test and simulation of printed circuit board Author(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage Year of publication: 2018 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-02516781v1
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation Author(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont Year of publication: 2018 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-02516790v1
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations Author(s): S. Pin, H. Fremont, A. Guédon-Gracia Year of publication: 2017 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2017.07.053 HAL link: https://hal.science/hal-01660890v1
Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering Author(s): Barriere Maxime, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, Francois Le Henaff Year of publication: 2017 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01671865v1
High temperature ageing of microelectronics assemblies with SAC solder joints Author(s): Wissam Sabbah, Pierre Bondue, Oriol Aviño Salvado, Cyril Buttay, Héìène Frémont, Alexandrine Guédon-Gracia, Hervé Morel Year of publication: 2017 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2017.06.065 HAL link: https://hal.science/hal-01564755v1
Effects of salt spray test on lead-free solder alloy Author(s): A. Guédon-Gracia, H. Frémont, B. Plano, Y. Delétage J., K. Weide-Zaage Year of publication: 2016 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2016.07.034 HAL link: https://hal.science/hal-01400240v1
Virtual prototyping in a Design-for-Reliability approach Author(s): S. Barnat, A. Guédon-Gracia, Hélène Frémont Year of publication: 2015 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01257900v1
Methodological approach for predictive reliability: practical case studies Author(s): Hélène Fremont, Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00788556v1
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength Author(s): S. Barnat, Hélène Fremont, Alexandrine Guedon-Gracia, Eric Cadalen Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00745982v1
Analysis of 2 aging types for SAC solder joint: accelerated thermal cycling (ATC) and thermal storage Author(s): Berthou Matthieu, Pascal Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, Catherine Jéphos-Davennel Year of publication: 2009 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00415091v1
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage Author(s): M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Year of publication: 2009 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00477613v1
Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2008 Journal: IEEE Transactions on Device and Materials Reliability DOI: HAL link: https://hal.science/hal-00403579v1
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2005 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179908v1
Influence of the thermo-mechanical residual state on the power assembly modellization Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini, Pascal Roux Year of publication: 2004 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179907v1
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini, Guillaume Simon Year of publication: 2003 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179906v1
Evaluation of lead-free soldering for automotive applications Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2002 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179904v1

Patents (1)

Procédé de mesure d'une épaisseur seuil de couche de matériau purement résistif, dispositif de mise en œuvre, et utilisation d'un tel dispositif dans un pot d'échappement Author(s): Francis Ménil, Claude Lucat, Pascal Tardy, Alexandrine Guédon, Patrick Ginet Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00163319v1

Conference proceedings (47)

Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules Author(s): Ariane Tomas, Loic Théolier, Alexandrine Guédon-Gracia, Hélène Frémont, Pierre-Yves Pichon Year of publication: 2025 Journal: DOI: HAL link: https://hal.science/hal-05323088v1
Evaluation of SAC solder joint thermomechanical fatigue in different types of components Author(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Year of publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758868 HAL link: https://hal.science/hal-03665823v1
Dynamics of the corrosion for SAC305 solder alloy in salt environment Author(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Year of publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758896 HAL link: https://hal.science/hal-03665831v1
QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms Author(s): E. Ben Romdhane, P. Roumanille, Alexandrine Guedon-Gracia, S. Pin, P. Nguyen, Helene Fremont Year of publication: 2022 Journal: DOI: 10.1109/ectc51906.2022.00120 HAL link: https://hal.science/hal-03781126v1
Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling Author(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Year of publication: 2021 Journal: DOI: 10.1109/ECTC32696.2021.00359 HAL link: https://hal.science/hal-03336972v1
Procédé de fabrication d’un circuit redresseur de puissance : de la fabrication de diodes Silicium à leur assemblage sur substrat métallisé d’alumine Author(s): Hélène Debéda, Alexandrine Gracia, Magali Dematos, Isabelle Favre, Bernard Plano, Jean Tomas, Reasmey Tan, C. Rouabhi, Marc Respaud Year of publication: 2021 Journal: DOI: HAL link: https://hal.science/hal-03500175v1
Statistical study of SAC solder joints in QFN and BGA assemblies Author(s): A. Gracia, A. Badetz, F. Arabi, B. Plano, H. Fremont Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02477114v1
Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations Author(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02517306v1
Etudes sans plomb au laboratoire IMS Author(s): Alexandrine Guedon-Gracia Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02516896v1
Electromigration Effects in Corroded BGA Author(s): Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Hélène Fremont Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02516854v1
Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Author(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02516984v1
Vibration test and simulation of printed circuit board Author(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02516844v1
Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire Author(s): O. Briat, J.-Y. Delétage, T. Dubois, G. Duchamp, H. Frémont, A. Guédon-Gracia, L. Theolier, J.-M. Vinassa, E. Woirgard Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02518400v1
Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Author(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02516819v1
Study of corrosion in BGA solder balls Author(s): K. Weide-Zaage, H. Frémont, A. Guédon-Gracia, Y. Feng, A. Chen Year of publication: 2017 Journal: DOI: HAL link: https://hal.science/hal-01552830v1
Lead free solder joints characterisation using single lap shear tests Author(s): Samuel Pin, Hélène Frémont, Alexandrine Guedon-Gracia Year of publication: 2017 Journal: DOI: HAL link: https://hal.science/hal-01660937v1
Corrosion study on BGA assemblies Author(s): A. Guédon-Gracia, H. Frémont, J. Y. Delétage, K. Weide-Zaage Year of publication: 2016 Journal: DOI: 10.1109/PanPacific.2016.7428402 HAL link: https://hal.science/hal-01400226v1
Etude de la corrosion de brasure sans Pb en brouillard salin Author(s): Alexandrine Guedon-Gracia Year of publication: 2016 Journal: DOI: HAL link: https://hal.science/hal-02516893v1
Harsh Marine Environment - Toward Corrosion Simulation Author(s): K. Weide-Zaage, A. Moujbani, H. Frémont, Alexandrine Guedon-Gracia Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01153317v1
A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability Author(s): H. Debéda, I. Favre, A. Guédon-Gracia, N. Labat, B. Plano, H. Frémont Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00905901v1
Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Author(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00744834v1
Thermal performance evaluation of SiC power devices packaging Author(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00788775v1
Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach Author(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00795337v1
Thermal performance evaluation of SiC power devices packaging Author(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00788331v1
Thermal performances evaluation of new high temperature power packages using SiC devices Author(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Eric Woirgard, Jean-Yves Delétage Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00795339v1
Development of high temperature packaging technologies for SiC power devices based on finite elements simulations and experiments: thermal approach Author(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00788759v1
Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Author(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00709116v1
Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques, Author(s): M. Berthou, H. Lu, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Davennel, C. Bailey Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00499499v1
Influence of PCB design and materials on chip solder joint reliability Author(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477591v1
Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Author(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477594v1
Moisture induced effects in PoP Author(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Frémont Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00385358v1
Electrically driven matter transport effects in PoP interconnections Author(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Frémont Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00385360v1
Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking Author(s): S. Barnat, S. Bellenger, H. Frémont, A. Guédon-Gracia, P. Talbot Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00385369v1
Méthodes d'analyses et mécanisme de propagation des fissures des joints de brasure SAC (Sn-Ag-Cu) en fatigue thermomécanique Author(s): M. Berthou, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00403608v1
Etude de la fiabilité des assemblages PoP (Package-on-Package) Author(s): W. Feng, H. Frémont, A. Guédon-Gracia, F. Verdier, B. Plano Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00403605v1
Analytical Model for Thermally-induced Warpage of POP Author(s): Wei Feng, Helene Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323410v1
Analytical model for thermally-induced warpage of POP Author(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00326445v1
High Density IC Packaging Reliability Author(s): Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier, Hélène Frémont Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323388v1
SiP vs SoC : An application-driven perspective Author(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00327271v1
Evaluation du Brasage sans Plomb pour des Applications Automobile Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2006 Journal: DOI: HAL link: https://hal.science/hal-00179938v1
Reliability Analysis of Lead-Free BGA Assemblies Linking FE Simulations and Experimental Results Author(s): Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini Year of publication: 2005 Journal: DOI: HAL link: https://hal.science/hal-00179928v1
An assessment of the connection between the working operations of a thyristor system used in a power plant and accelerated ageing tests Author(s): Alexandrine Guédon-Gracia, Guillaume Simon, Eric Woirgard, Christian Zardini Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00179922v1
Evaluation by Simulation of the Ageing State of a Thyristor System Used in a Power Plant Author(s): Alexandrine Guédon-Gracia, Guillaume Simon, Eric Woirgard, Christian Zardini Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00179919v1
Répercussion de l'état mécanique dû à la fabrication d'un assemblage de puissance sur la modélisation de sa durée de vie Author(s): Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00179942v1
Lead-Free Electronics For Automotive Applications: Specific Constraints, Failure Modes And Related Design Guidelines For Reliability Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini, Gérard-Marie Martin Year of publication: 2003 Journal: DOI: HAL link: https://hal.science/hal-00179917v1
Evaluation du brasage sans plomb pour des applications automobile Author(s): Alexandrine Guédon-Gracia Year of publication: 2003 Journal: DOI: HAL link: https://hal.science/hal-00179939v1
An Assessment of Lead-Free Soldering for Automotive Applications: Influence of the Components Finishes on the Reliability of Solder Joints Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2002 Journal: DOI: HAL link: https://hal.science/hal-00179916v1

Invited lectures (3)

Quelles sont les solutions de substitution ? Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2005 Journal: DOI: HAL link: https://hal.science/hal-00179936v1
Description du réseau ELFNET Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00179933v1
Projet ELFNET, Réseau européen sur le brasage sans plomb Author(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00179934v1

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