Isabelle FAVRE

Engineer

Research group : RELIABILITY

Team : REMI,RESS,RIAD,WBG

Tel : 0540003839

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Article (2)

Vers l’électronique imprimée à l’IMS Bordeaux - plateforme technologique TAMIS (Technologies Alternatives aux MIcrosystèmes Silicium) Author(s): Hélène Debéda, Ludivine Fadel-Taris, Isabelle Favre, Jean-Luc Lachaud, Jean Tomas Year of publication: 2015 Journal: Journal sur l'enseignement des sciences et technologies de l'information et des systèmes DOI: 10.1051/j3ea/2015014 HAL link: https://hal.science/hal-01242534v1
Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly. Author(s): J.-Y. Delétage, E. Woirgard, I. Favre, P. Lagonotte, G. Burban Year of publication: 2007 Journal: SOCIÉTÉS DES INGÉNIEURS DE L'AUTOMOBILE DOI: HAL link: https://hal.science/hal-00380410v1

Poster communication (1)

Procédé de frittage de pâte d'argent double face adapté aux composants silicium avec métallisation supérieure aluminium Author(s): Barriere Maxime, Stephane Azzopardi, Isabelle Favre, Eric Woirgard, Serge Bontemps, Francois Le Henaff Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01671856v1

Other publication (1)

Vers l'électronique imprimée à l'IMS Bordeaux -plateforme technologique TAMIS (Technologie Alternative aux Microsystèmes Silicium) Author(s): Hélène Debéda, Ludivine Fadel-Taris, Isabelle Favre, Jean Tomas Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-01717704v1

Conference proceedings (10)

Procédé de fabrication d’un circuit redresseur de puissance : de la fabrication de diodes Silicium à leur assemblage sur substrat métallisé d’alumine Author(s): Hélène Debéda, Alexandrine Gracia, Magali Dematos, Isabelle Favre, Bernard Plano, Jean Tomas, Reasmey Tan, C. Rouabhi, Marc Respaud Year of publication: 2021 Journal: DOI: HAL link: https://hal.science/hal-03500175v1
Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization Author(s): Barriere Maxime, Stephane Azzopardi, Raphaël Roder, Isabelle Favre, Eric Woirgard, Serge Bontemps, François Le Henaff Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01671837v1
Vers l’électronique imprimée à l’IMS Bordeaux - plateforme technologique TAMIS (Technologies Alternatives aux Microsystèmes Silicium) Author(s): Hélène Debéda, Ludivine Fadel-Taris, Isabelle Favre, Jean Tomas Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-01101684v1
Feasibility of screen-printed PZT microceramics for piezocomposites applications Author(s): Hélène Debéda, Riadh Lakhmi, Isabelle Favre, Jonathan Argillos, Claude Lucat, Mario Maglione, Valérie Budinger, Xavier Hochart Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00796191v1
A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability Author(s): H. Debéda, I. Favre, A. Guédon-Gracia, N. Labat, B. Plano, H. Frémont Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00905901v1
Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Author(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00744834v1
A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation: towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices Author(s): Yassine Belmehdi, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Isabelle Favre Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00585076v1
Thermo-mechanical simulations in double-sided heat transfer power assemblies Author(s): Eric Woirgard, Isabelle Favre, Jean-Yves Delétage, Stephane Azzopardi, Renan Léon, Guy Convenant, Zoubir Khatir Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00584904v1
Thermo-mechanical optimization of heat spreader geometry for an automotive power assembly Author(s): J.-Y. Delétage, E. Woigard, I. Favre, P. Lagonotte, G. Burban Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00380428v1
Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly Author(s): Eric Woirgard, Jean-Yves Delétage, Isabelle Favre, Patrick Lagonotte, Gwenael Burban Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00182176v1

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